中文

Faculty

Teaching and Research Series

DAI Xiaochuan

Tel:010-62792899

E-mail:xcdai@tsinghua.edu.cn

  • Exploring the Ideal Interface and Seamless Integration System Between Electronic Devices and Biological Tissues

    Laboratory Homepage: http://daigroup.org

    Professor Dai Xiaochuan obtained his bachelor’s degree from Peking University in 2010 and his doctoral degree from Harvard University in 2015. Subsequently, he conducted postdoctoral research at the Department of Chemistry of Harvard University, the Department of Biomedical Engineering of Tufts University, and the Department of Electrical Engineering of the Massachusetts Institute of Technology (MIT). In November 2020, he joined Tsinghua University full-time and established the Living Bioelectronics Laboratory.

    His research focuses on bio-stealth neural electrodes, cyborg tissue, implantable brain-computer interfaces (BCIs), and their translational applications. He has published more than 20 papers in top journals including Science, Nature Nanotechnology, Nature Materials, and PNAS (Proceedings of the National Academy of Sciences of the United States of America). He has filed over 10 invention patent applications and presided over or participated in more than 10 research projects funded by institutions such as the National Natural Science Foundation of China, the Ministry of Science and Technology, national laboratories, and the Beijing Municipal Government.

    He is invited to serve as Associate Editor of Nano TransMed, Editorial Board Member of Brain Network Disorders and Frontiers in Neuroscience, Expert of the Carbon-Based Sensing and Device Standardization Working Group under the National Technical Committee on Micro-Electro-Mechanical Systems of Standardization Administration of China (SAC/TC336), Committee Member of the Brain-Computer Interface Biomaterials Branch and Neural Repair Materials Branch of the Chinese Society for Biomaterials, and Committee Member of the Brain-Computer Interface Subcommittee of the National Technical Committee on Information Technology Standardization (SAC/TC28/SC43).


  • Professor Dai Xiaochuan focuses on achieving seamless structural integration and functional signal coupling between bioelectronics and biological tissues/animals. To this end, he has developed a bioelectronic system that mimics tissue scaffold morphology to match the physical, chemical, and mechanical properties of biological tissues.

    This novel living bioelectronic system can:

    Be precisely implanted into the brains of living animals and integrate with neural tissue to form seamless brain-computer interfaces (BCIs) for understanding brain function or treating neurological disorders

    Serve as functional tissue scaffolds in artificial tissue or organoid engineering to construct Cyborg Tissues that enable bidirectional interaction with external organ models

    Research Directions

    1. Development of novel tissue-mimicking scaffold flexible electronic devices

    Enabling artificial electronic devices to seamlessly integrate into biological tissues while maintaining biocompatibility and functionality.

    2. Development of precise minimally invasive implantation methods for tissue-mimicking scaffold flexible electronics

    Building high-throughput, zero-rejection, and lifelong stable brain-computer interface systems.

    3. Integration of multimodal, cross-scale neural technologies

    Constructing electrical, optical, magnetic, acoustic, and chemical multimodal neural interface systems to explore brain development, aging, learning, and regeneration processes.

    4. Construction of Cyborg Tissues/Organs based on tissue-mimicking scaffold flexible electronic systems

    Exploring organoid development and intelligent emergence processes through bidirectional interaction between artificial tissues and electronic devices.


  • 1. Q. Duan#, S. Wu#, R. Liu*, J. Yu, X. Liu, Y. Hao, Z. Liu, K. Chan, P. Zhang, J. Zang, J. Tan, W. Xu, Z. Wang and X. Dai*, “Subcellular-Scale Stimulation Electrode Arrays (3SEA) Enabled by Diffusion-Tuned PEDOT:PSS Galvanostatic Deposition”, Nano Letters, Epub ahead of print. PMID: 41773494 (2026).

    2. X. Dai#, W. Zhou#, T. Gao, J. Liu and C. M. Lieber*, “Three-dimensional mapping and regulation of action potential propagation in nanoelectronics-innervated tissues”, Nature Nanotechnology, 11, 776–782 (2016).

    3. X. Dai, G. Hong, T. Gao and C. M. Lieber*, “Mesh nanoelectronics: Seamless integration of electronics with tissues”, Accounts of Chemical Research, 51, 309–318 (2018).

    4. X. Dai#, R. Vo#, H. Hsu, P. Deng and X. Jiang*, “Modularized Field-Effect Transistor Biosensors”, Nano Letters, 19, 6658–6664 (2019).

    5. H. H. Bay#, R. Vo#, X. Dai#,*, H. Hsu, S. Cao, Z. Mo, W. Li, F. Omenetto and X. Jiang*, “Hydrogel-gate graphene field effect transistors as multiplexed biosensors”, Nano Letters, 19, 2620–2626 (2019).

    6. C. Xie#, J. Liu#, T. Fu#, X. Dai, W. Zhou and C. M. Lieber*, “Three dimensional macroporous nanoelectronic networks as minimally-invasive brain probes”, Nature Materials, 14, 1286–1292 (2015).

    7. W. Zhou#, X. Dai#, T. Fu, C. Xie, J. Liu and C. M. Lieber*, “Long-term stability of nanowire nanoelectronics in physiological environments”, Nano Letters, 14, 1614–1619 (2014).

    8. J. Liu#, C. Xie#, X. Dai#, L. Jin, W. Zhou and C. M. Lieber*, “Multi-functional three-dimensional macroporous nanoelectronic networks for smart materials”, PNAS, 110, 6694–6699 (2013).

    9. Y. Yao#, X. Dai#, C. Feng, J. Zhang*, X. Liang, L. Ding, W. Choi, J. Choi*, J. Kim and Z. Liu*, “Crinkling ultralong carbon nanotubes into serpentines by a controlled landing process”, Advanced Materials, 21, 4158–4162 (2009).



  • Academic Honors and Awards

    1. Gold Medal with Jury Congratulations of The 51st International Exhibition of Inventions of Geneva

    2. Gold Medal of The 51st International Exhibition of Inventions of Geneva

    3. First Prize of 2025 National Disruptive Technology Innovation Competition: Brain-Computer System Competition

    4. First Prize of CAI 2025 Invention and Entrepreneurship Award–Project Award

    5. IFIA Best Invention Award

    6. iENA 2025 Gold Medal

    7. The 11th International Exhibition of Inventions Gold Prize

    8. Second Prize of Tsinghua University Teaching Achievement Award

    9. APBEC Young Scholar Award

    10. MIT Technology Review Innovators Under 35 (TR35)

    11. Beijing Nova Program

    12. QiuSuo Program for Distinguished Young Scholars, LinGang National Laboratory

    13. Chinese Government Award for Outstanding Students Studying Abroad

    14. May-4th Medal for outstanding undegraduate students, Peking University

    15. Academic Star of Promise of Peking University

    16. Grand Prize of “Challenge Cup” contest, Peking University

    17. Outstanding Graduate of Beijing

    18. Outstanding Graduate of Peking University

    19. National Scholarship

    20. First Prize in Chinese College Physics Competition

    21. Medalist in Chinese Chemistry Olympiad (CChO)

    22. Medalist in Chinese Mathematics Olympiad (CMO)


    Technical Patents

    1. Xiaochuan Dai, Xinyue Wang, Pan Zhang, Jinyu Zang, Jiaheng Yu, Yi He, Adaptive 3D structural network, CN 202511770265.4, Applied on November 28, 2025.

    2. Xiaochuan Dai, Yan Zhao, Yingjie Hao, Shipeng Lin, Full-wafer electroplating method for flexible electronics and flexible electroplated structural chip, CN 202511766491.5, Applied on November 27, 2025.

    3. Xiaochuan Dai, Yan Zhao, Shuying Wu, Jiaheng Yu, Yingjie Hao, In vitro implantation process simulation platform, CN 202511766478.X, Applied on November 27, 2025.

    4. Xiaochuan Dai, Guangyu Liang, Jiaheng Yu, Yuan Shuai, Yingjie Hao, PDMS-based blood vessel mimics and fabrication method, CN 202511766490.0, Applied on November 27, 2025.

    5. Xiaochuan Dai, Xinyue Wang, Mingxue Dai, Xiao Li, Yi He, An auxiliary component for sampling and delivery of liquids and flexible electronic devices, CN 202511552763.1, Applied on October 28, 2025.

    6. Xiaochuan Dai, Yan Zhao, Rongqing Yuan, Zhen Liu, Fabrication method of shuttle for flexible electronic device implantation, CN 202210593811.1, Applied on May 27, 2022.

    7. Xiaochuan Dai, Zhen Liu, Yan Zhao, Flexible neural electrode and its fabrication, implantation method, and systems, CN 202210594656.5, Applied on May 27, 2022. (Licensed for ￥900,000)

    8. Xiaocheng Jiang, Xiaochuan Dai, Richards Vo, Modularized field-effect transistor biosensors, US 62/885,627, Applied on August 12, 2019.

    9. Jin Zhang, Yagang Yao, Xiaochuan Dai, Zhongfan Liu, Method for preparing isotactic single-walled carbon nano-tube array, ZL 200910088735.3, Granted on April 13, 2011.



    Courses Offered

    1. Biomedical Electronics (1)–Sensors (Autumn)

    2. Comprehensive Design of Biomedical Engineering (Spring)

    3. Scientific Writing and Communication in Biomedical Engineering (Autumn)

    4. Frontiers and Practice of Micro-Nano Medicine (Fall)

    5. Flexible Electronics and Wearable Devices (Fall)

    6. Technology Innovation and Challenges–2C (Spring&Autumn)

    7. Technology Innovation and Challenges–3C (Autumn)

    8. Technology Innovation and Challenges–4C (Spring)

    9. Scientific Training (Spring)

    10. Creative Design (Summer)


Contact us:

Tel:86-62787861

Email:sygcxybgs@mail.tsinghua.edu.cn

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